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Packaging Module Development Engineer
The median salary range for Packaging Module Development Engineer disclosed in public job postings is $115k - $197k as of Jul 2026, based on 13 job postings from 2 companies.
Salary Range
Low
$115,110
26%
Mid
$155,833
26%
High
$196,555
Small Sample Size
7 Data Points
Data Points
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Packaging Module Development Engineer
Phoenix
·4+ Years Experience
Active
$115k - $220k
$115,110 - $219,550
Packaging Module Development Engineer
Hillsboro
·3+ Years Experience
Active
$115k - $220k
$115,110 - $219,550
Packaging Module Development Engineer
Phoenix
·6+ Years Experience
Active
$115k - $189k
$115,110 - $188,890
Packaging Module Development Engineer
Phoenix
·1+ Years Experience
Active
$115k - $163k
$115,110 - $162,500
Packaging Module Development Engineer
Malaysia
·5+ Years Experience
Active
N/A
N/A
Packaging Module Development Engineer
Phoenix
·4+ Years Experience
Active
$115k - $220k
$115,110 - $219,550
Packaging Module Development Engineer
Hillsboro
·3+ Years Experience
Active
$115k - $220k
$115,110 - $219,550
Packaging Module Development Engineer
Phoenix
·1+ Years Experience
Active
$134k - $189k
$133,800 - $188,890
Packaging Module Development Engineer
Phoenix
·6+ Years Experience
Active
$115k - $189k
$115,110 - $188,890
Packaging Module Development Engineer
Phoenix
·1+ Years Experience
Active
$85k - $163k
$85,200 - $162,500
Direct Lid/Stiffener Attach Packaging Module Development Engineer
Malaysia
Active
N/A
N/A
Packaging Module Development Engineer
Malaysia
Active